Internal spacers for nanowire semiconductor devices
US10361268B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 28, 2018 |
| Grant date | Jul 23, 2019 |
| Priority date | — |
| Expiry date | Feb 28, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/31116
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A method of forming an internal spacer between nanowires, the method involving: providing a fin comprising a stack of layers of sacrificial material alternated with nanowire material, and selectively removing part of the sacrificial material, thereby forming a recess. The method also involves depositing dielectric material into the recess resulting in dielectric material within the recess and excess dielectric material outside the recess, where a crevice remains in the dielectric material in each recess, and removing the excess dielectric material using a first etchant. The method also involves enlarging the crevices to form a gap using a second etchant such that a remaining dielectric material still covers the sacrificial material and partly covers the nanowire material, and such that outer ends of the nanowire material are accessible; and growing electrode material on the outer ends such that the electrode material from neighboring outer ends merge, thereby covering the gap.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.