Liesbeth Witters
21Patents
5h-index
32Co-inventors
61Inventor score
Filing activity: Feb 15, 2013 → May 18, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9123566B2 | Complementary metal-oxide-semiconductor device comprising silicon and germanium and method for manufacturing thereof | Electricity | 15 | Active |
| US9476143B2 | Methods using mask structures for substantially defect-free epitaxial growth | Electricity | 10 | Active |
| US9842777B2 | Semiconductor devices comprising multiple channels and method of making same | Electricity | 9 | Active |
| US10269929B2 | Internal spacer formation for nanowire semiconductor devices | Performing Operations; Transporting | 7 | Active |
| US9070712B2 | Methods for manufacturing a field-effect semiconductor device | Electricity | 7 | Active |
| US9633891B2 | Method for forming a transistor structure comprising a fin-shaped channel structure | Electricity | 4 | Active |
| US10361268B2 | Internal spacers for nanowire semiconductor devices | Electricity | 3 | Active |
| US10090393B2 | Method for forming a field effect transistor device having an electrical contact | Electricity | 1 | Active |
| US11195767B2 | Integration of a III-V device on a Si substrate | Electricity | 1 | Active |
| US9478544B2 | Method for forming a germanium channel layer for an NMOS transistor device, NMOS transistor device and CMOS device | Electricity | 1 | Active |
| US10714595B2 | Method of forming a semiconductor device comprising at least one germanium nanowire | Electricity | 0 | Active |
| US11387350B2 | Semiconductor fin structure and method of fabricating the same | Electricity | 0 | Active |
| US8828826B2 | Method for manufacturing a transistor device comprising a germanium based channel layer | Electricity | 0 | Active |
| US11355618B2 | Low parasitic Ccb heterojunction bipolar transistor | Electricity | 0 | Active |
| US10340139B2 | Methods and mask structures for substantially defect-free epitaxial growth | Electricity | 0 | Active |
| US9343329B2 | Contact formation in Ge-containing semiconductor devices | Electricity | 0 | Active |
| US9502415B2 | Method for providing an NMOS device and a PMOS device on a silicon substrate and silicon substrate comprising an NMOS device and a PMOS device | Electricity | 0 | Active |
| US9299563B2 | Method for forming a strained semiconductor structure | Electricity | 0 | Active |
| US11557503B2 | Method for co-integration of III-V devices with group IV devices | Electricity | 0 | Active |
| US11646200B2 | Integration of a III-V construction on a group IV substrate | Electricity | 0 | Active |
| US9972622B2 | Method for manufacturing a CMOS device and associated device | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.