Photosensitive resin composition, method for manufacturing cured resin film, and semiconductor device
US10365559B2 · kind B2 · utility
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3References
15Claims
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Key dates
| Filing date | Feb 9, 2016 |
| Grant date | Jul 30, 2019 |
| Priority date | — |
| Expiry date | Feb 9, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/07025
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Provided is a photosensitive resin composition containing: one or more kinds of alkali-soluble resins selected from a polyimide, a polybenzoxazole, a polyimide precursor, a polybenzoxazole precursor, and a copolymer formed of two or more polymers selected from the preceding substances; and a photosensitizer. The photosensitive resin composition further contains a compound represented by general formula (1). Even when a cured film is fired at low temperature, the photosensitive resin composition exhibits superior adhesion properties with metallic materials, particularly copper, and also exhibits high chemical resistance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.