Articles having holes with morphology attributes and methods for fabricating the same

US10366904B2 · kind B2 · utility

Assignee

• CORNING INCORPORATED · US

Inventors

• Andres Covarrubias Jaramillo · Corning, US
• Yuhui Jin · Corning, US
• Frank Andrew Kramer, IV · Corning, US
• Ekaterina Aleksandrovna Kuksenkova · Corning, US
• Daniel Wayne Levesque, JR. · Terrebonne, CA
• Garrett Andrew Piech · Corning, US
• Aric Bruce Shorey · Webster, US
• Robert Stephen Wagner · Corning, US

Key dates

• Filing date: Sep 6, 2017
• Grant date: Jul 30, 2019
• Expiry date: Sep 6, 2037

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2224/16225
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Articles including a glass-based substrate with holes, semiconductor packages including an article with holes, and methods of fabricating holes in a substrate are disclosed. In one embodiment, an article includes a glass-based substrate having a first surface, a second surface, and at least one hole extending from the first surface. The at least one hole has an interior wall having a surface roughness Ra that is less than or equal to 1 μm. The at least one hole has a first opening having a first diameter that is present the first surface. A first plane is defined by the first surface of the glass-based substrate based on an average thickness of the glass-based substrate. A ratio of a depression depth to the first diameter of the at least one hole is less than or equal to 0.007.