Inventor · Terrebonne, QC, CA

Daniel Wayne Levesque, JR.

13Patents
6h-index
32Co-inventors
66Inventor score

Filing activity: Sep 15, 1993 → Nov 2, 2018

Most-cited inventions

PatentTitleAreaCited byStatus
US6057927A Laser-ultrasound spectroscopy apparatus and method with detection of shear resonances for measuring anisotropy, thickness, and other properties Physics 212 Expired
US6128092A Method and system for high resolution ultrasonic imaging of small defects or anomalies. Physics 29 Expired
US7353709B2 Method and system for determining material properties using ultrasonic attenuation Physics 21 Active
US5408881A High resolution ultrasonic interferometry for quantitative mondestructive characterization of interfacial adhesion in multilayer composites Physics 20 Expired
US6532821B2 Apparatus and method for evaluating the physical properties of a sample using ultrasonics Physics 19 Expired
US6397680B1 Ultrasonic spectroscopy apparatus for determining thickness and other properties of multilayer structures Physics 11 Expired
US10077206B2 Methods of etching glass substrates and glass substrates Emerging Cross-Sectional Technologies 4 Active
US10134657B2 Inorganic wafer having through-holes attached to semiconductor wafer Electricity 2 Active
US10366904B2 Articles having holes with morphology attributes and methods for fabricating the same Electricity 2 Active
US10424606B1 Systems and methods for reducing substrate surface disruption during via formation Electricity 1 Active
US7988763B2 Use of a binary salt flux of NaCl and MgCl2 for the purification of aluminium or aluminium alloys, and method thereof Chemistry; Metallurgy 0 Active
US10756003B2 Inorganic wafer having through-holes attached to semiconductor wafer Electricity 0 Active
US11608291B2 Micro-perforated panel systems, applications, and methods of making micro-perforated panel systems Physics 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.