Chip bonding apparatus, chip bonding method and a chip package structure
US10366965B2 · kind B2 · utility
0Cited by
5References
18Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Dec 28, 2017 |
| Grant date | Jul 30, 2019 |
| Priority date | — |
| Expiry date | Dec 28, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A chip bonding apparatus for bonding a chip and a redistribution structure with each other is provided. The chip bonding apparatus includes a pick and place module and an alignment module. The pick and place module is suitable for picking up and placing the chip. The alignment module is movably connected to the pick and place module. The alignment module includes at least one alignment protrusion, wherein the at least one alignment protrusion extends toward at least one alignment socket included in the redistribution structure. Furthermore, a chip bonding method and a chip package structure are provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.