Shu-Wei Kuo
16Patents
3h-index
20Co-inventors
56Inventor score
Filing activity: Jan 4, 2010 → Jan 26, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7821699B1 | Electrowetting display and method for fabricating the same | Physics | 50 | Active |
| US8059328B1 | Electrowetting display devices | Physics | 31 | Active |
| US8830558B2 | Electrowetting display device | Physics | 7 | Active |
| US10522438B2 | Package structure having under ball release layer and manufacturing method thereof | Electricity | 2 | Active |
| US9743513B2 | Flexible electronic device | Electricity | 2 | Active |
| US8213072B1 | Electrofluidic display device and driving method thereof | Physics | 1 | Active |
| US8587857B2 | Electro-wetting display device and non-polar color solution thereof | Chemistry; Metallurgy | 1 | Active |
| US10573587B2 | Package structure and manufacturing method thereof | Electricity | 1 | Active |
| US9046681B2 | Electro-wetting element and operation method thereof, electro-wetting display device | Physics | 1 | Active |
| US8717281B2 | Electrofluidic device and operation method thereof | Physics | 0 | Active |
| US11329500B2 | Charging and discharging device and charging and discharging method | Emerging Cross-Sectional Technologies | 0 | Active |
| US11646259B2 | Redistribution structure and forming method thereof | Electricity | 0 | Active |
| US10366965B2 | Chip bonding apparatus, chip bonding method and a chip package structure | Electricity | 0 | Active |
| US10249567B2 | Redistribution layer structure of semiconductor package | Electricity | 0 | Active |
| US9069250B2 | Electrowetting display unit and method for manufacturing thereof | Physics | 0 | Active |
| US10461035B2 | Semiconductor package structure | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.