Body tie optimization for stacked transistor amplifier
US10367453B2 · kind B2 · utility
10Cited by
20References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 12, 2017 |
| Grant date | Jul 30, 2019 |
| Priority date | — |
| Expiry date | Dec 12, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03F2200/75
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A transistor stack can include a combination of floating and body tied devices. Improved performance of the RF amplifier can be obtained by using a single body tied device as the input transistor of the stack, or as the output transistor of the stack, while other transistors of the stack are floating transistors. Transient response of the RF amplifier can be improved by using all body tied devices in the stack.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.