Wafer-level-packaged BAW devices with surface mount connection structures
US10367470B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 6, 2017 |
| Grant date | Jul 30, 2019 |
| Priority date | — |
| Expiry date | Nov 27, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N30/50
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
The present disclosure relates to a Wafer-Level-Packaged (WLP) Bulk Acoustic Wave (BAW) device that includes a BAW resonator, a WLP enclosure, and a surface mount connection structure. The BAW resonator includes a piezoelectric layer with an opening and a bottom electrode lead underneath the piezoelectric layer, such that a portion of the bottom electrode lead is exposed through the opening of the piezoelectric layer. The WLP enclosure includes a cap and an outer wall that extends from the cap toward the piezoelectric layer to form a cavity. The opening of the piezoelectric layer is outside the cavity. The surface mount connection structure covers a portion of a top surface of the cap and extends continuously over a side portion of the WLP enclosure and to the exposed portion of the bottom electrode lead through the opening of the piezoelectric layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.