Method and apparatus for strain relieving surface mount attached connectors
US10368441B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 22, 2018 |
| Grant date | Jul 30, 2019 |
| Priority date | — |
| Expiry date | Mar 22, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10977
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An interconnect structure that includes a component circuit board containing a plurality of electrical components, and a wafer connector assembly. The wafer connector assembly includes a plurality of interconnect circuit boards that are in electrical connection with the components circuit board through a plurality of rows of solder joints, the plurality of interconnect circuit boards having a connection end including at least one contact. An adhesive is present structurally reinforcing at least a row of the solder joints that is proximate to the connection end of the plurality of interconnect circuit boards of the wafer assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.