Thomas E. Lombardi
35Patents
5h-index
85Co-inventors
72Inventor score
Filing activity: Dec 30, 1993 → Dec 21, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5480503A | Process for producing circuitized layers and multilayer ceramic sub-laminates and composites thereof | Emerging Cross-Sectional Technologies | 89 | Expired |
| US6518674B2 | Temporary attach article and method for temporary attach of devices to a substrate | Emerging Cross-Sectional Technologies | 19 | Expired |
| US6762119B2 | Method of preventing solder wetting in an optical device using diffusion of Cr | Electricity | 12 | Expired |
| US5643818A | Removal of residues from metallic insert used in manufacture of multi-layer ceramic substrate with cavity for microelectronic chip | Electricity | 9 | Expired |
| US6528352B1 | Use of conductive adhesive to form temporary electrical connections for use in TCA (temporary chip attach) applications | Physics | 8 | Expired |
| US5489465A | Edge seal technology for low dielectric/porous substrate processing | Emerging Cross-Sectional Technologies | 5 | Expired |
| US9798088B2 | Barrier structures for underfill blockout regions | Physics | 5 | Active |
| US9093563B2 | Electronic module assembly with patterned adhesive array | Electricity | 3 | Active |
| US9048245B2 | Method for shaping a laminate substrate | Emerging Cross-Sectional Technologies | 3 | Active |
| US5795217A | Stressed burnisher | Emerging Cross-Sectional Technologies | 3 | Expired |
| US6376054B1 | Surface metallization structure for multiple chip test and burn-in | Emerging Cross-Sectional Technologies | 2 | Expired |
| US9059240B2 | Fixture for shaping a laminate substrate | Electricity | 2 | Active |
| US8304290B2 | Overcoming laminate warpage and misalignment in flip-chip packages | Electricity | 2 | Active |
| US9627784B1 | Method and apparatus for strain relieving surface mount attached connectors | Electricity | 1 | Active |
| US9543253B2 | Method for shaping a laminate substrate | Emerging Cross-Sectional Technologies | 1 | Active |
| US8129230B2 | Underfill method and chip package | Electricity | 1 | Active |
| US9455234B2 | Fixture to constrain laminate and method of assembly | Emerging Cross-Sectional Technologies | 0 | Active |
| US11228124B1 | Connecting a component to a substrate by adhesion to an oxidized solder surface | Emerging Cross-Sectional Technologies | 0 | Active |
| US8492910B2 | Underfill method and chip package | Electricity | 0 | Active |
| US8759151B2 | Fixture to constrain laminate and method of assembly | Emerging Cross-Sectional Technologies | 0 | Active |
| US10985129B2 | Mitigating cracking within integrated circuit (IC) device carrier | Electricity | 0 | Active |
| US11152226B2 | Structure with controlled capillary coverage | Electricity | 0 | Active |
| US9433105B2 | Method of fabricating printed circuit boards | Emerging Cross-Sectional Technologies | 0 | Active |
| US8188597B2 | Fixture to constrain laminate and method of assembly | Emerging Cross-Sectional Technologies | 0 | Active |
| US10368441B2 | Method and apparatus for strain relieving surface mount attached connectors | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.