Integrated circuit with dielectric waveguide connector using photonic bandgap structure
US10371891B2 · kind B2 · utility
2Cited by
32References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 31, 2017 |
| Grant date | Aug 6, 2019 |
| Priority date | — |
| Expiry date | Oct 31, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q1/2283
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An encapsulated integrated circuit package is provided that includes an integrated circuit (IC) die. A radio frequency (RF) circuit on the IC die is operable to send and/or receive an RF signal having a selected frequency. Encapsulation material encapsulates the IC die. A photonic waveguide couples to the RF circuit and extends to an external surface of the encapsulated IC. The photonic waveguide may be formed by a photonic bandgap structure within the encapsulation material. A socket may be included with the encapsulated package that is coupled to an end of the photonic waveguide opposite the RF circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.