Inventor · Addison, TX, US

Daniel Lee Revier

31Patents
2h-index
15Co-inventors
46Inventor score

Filing activity: Apr 20, 2017 → Dec 4, 2023

Most-cited inventions

PatentTitleAreaCited byStatus
US10908414B2 Lens cleaning via electrowetting Physics 13 Active
US10780467B2 Methods and apparatus for surface wetting control Mechanical Engineering; Lighting; Heating 3 Active
US10371891B2 Integrated circuit with dielectric waveguide connector using photonic bandgap structure Electricity 2 Active
US10788367B2 Integrated circuit using photonic bandgap structure Electricity 1 Active
US11693235B2 Lens cleaning via electrowetting Physics 1 Active
US10444432B2 Galvanic signal path isolation in an encapsulated package using a photonic structure Electricity 1 Active
US11031364B2 Nanoparticle backside die adhesion layer Electricity 1 Active
US11865773B2 Additive process for circular printing of electronic devices Emerging Cross-Sectional Technologies 1 Active
US11404270B2 Microelectronic device substrate formed by additive process Electricity 0 Active
US11728111B2 Liquid metal MEMS switch Electricity 0 Active
US11417540B2 3D printed semiconductor package Electricity 0 Active
US11271296B2 Molded packaged antenna Electricity 0 Active
US10553573B2 Self-assembly of semiconductor die onto a leadframe using magnetic fields Electricity 0 Active
US10861715B2 3D printed semiconductor package Electricity 0 Active
US10170384B2 Methods and apparatus providing a graded package for a semiconductor Emerging Cross-Sectional Technologies 0 Active
US11355414B2 Nanoparticle matrix for backside heat spreading Electricity 0 Active
US10557754B2 Spectrometry in integrated circuit using a photonic bandgap structure Electricity 0 Active
US12042829B2 Methods and apparatus for surface wetting control Mechanical Engineering; Lighting; Heating 0 Active
US11676930B2 Nanoparticle backside die adhesion layer Electricity 0 Active
US11487206B2 Methods and apparatus for digital material deposition onto semiconductor wafers Electricity 0 Active
US12046430B2 Liquid metal MEMS switch Electricity 0 Active
US11869925B2 3D printed semiconductor package Electricity 0 Active
US10497651B2 Electromagnetic interference shield within integrated circuit encapsulation using photonic bandgap structure Electricity 0 Active
US10833648B2 Acoustic management in integrated circuit using phononic bandgap structure Electricity 0 Active
US10910465B2 3D printed semiconductor package Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.