Method for predicting location of mark
US10373330B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jan 13, 2017 |
| Grant date | Aug 6, 2019 |
| Priority date | — |
| Expiry date | Oct 1, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06V2201/06
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method for predicting the location of mark is performed for a substrate which includes a plurality of electronic device regions each electronic region includes a mark and a reference indication on a first surface and a sawing indication on a second surface opposite to the first surface. The method includes obtaining first and second image information for the first and second surfaces, extracting a sawing line based on the sawing indication in the second image information, calculating a first spaced distance between the sawing line and the reference indication in the first information, calculating a second spaced distance between the sawing line and the reference indication, and predicting the location of the mark based on whether the first and second spaced distances correspond to a predetermined reference distance. The mark is on each of the electronic device regions separated from each other along the sawing line.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.