Tea-Geon Kim
8Patents
1h-index
7Co-inventors
36Inventor score
Filing activity: Dec 28, 2016 → Apr 7, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10748855B2 | Laminating device and method for fabricating semiconductor package using the same | Electricity | 1 | Active |
| US10665477B2 | Substrate cleaning apparatus and substrate processing facility having the same | Electricity | 1 | Active |
| US10741430B2 | Stack boat tool and method using the same | Electricity | 0 | Active |
| US11776946B2 | Method of manufacturing package-on-package device and bonding apparatus used therein | Electricity | 0 | Active |
| US10833046B2 | Stack tool for reflow and stack apparatus having the same | Electricity | 0 | Active |
| US10373330B2 | Method for predicting location of mark | Physics | 0 | Active |
| US10998303B2 | Method of manufacturing package-on-package device and bonding apparatus used therein | Electricity | 0 | Active |
| US10900883B2 | Mold test apparatus and method | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.