Package-embedded thin-film capacitors, package-integral magnetic inductors, and methods of assembling same
US10373951B1 · kind B1 · utility
2Cited by
4References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 25, 2018 |
| Grant date | Aug 6, 2019 |
| Priority date | — |
| Expiry date | Jun 25, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed embodiments include an embedded thin-film capacitor and a magnetic inductor that are assembled in two adjacent build-up layers of a semiconductor package substrate. The thin-film capacitor is seated on a surface of a first of the build-up layers and the magnetic inductor is partially disposed in a recess in the adjacent build up layer. The embedded thin-film capacitor and the integral magnetic inductor are configured within a die shadow that is on a die side of the semiconductor package substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.