Inventor · Chandler, AZ, US

Sai Vadlamani

33Patents
2h-index
37Co-inventors
49Inventor score

Filing activity: Dec 29, 2016 → Jan 17, 2024

Most-cited inventions

PatentTitleAreaCited byStatus
US11158558B2 Package with underfill containment barrier Electricity 4 Active
US10700021B2 Coreless organic packages with embedded die and magnetic inductor structures Electricity 2 Active
US10373951B1 Package-embedded thin-film capacitors, package-integral magnetic inductors, and methods of assembling same Electricity 2 Active
US10643994B2 Package-embedded thin-film capacitors, package-integral magnetic inductors, and methods of assembling same Electricity 2 Active
US11664290B2 Package with underfill containment barrier Electricity 2 Active
US11557489B2 Cavity structures in integrated circuit package supports Electricity 1 Active
US10741947B2 Plated through hole socketing coupled to a solder ball to engage with a pin Electricity 1 Active
US11251113B2 Methods of embedding magnetic structures in substrates Electricity 1 Active
US11552008B2 Asymmetric cored integrated circuit package supports Electricity 1 Active
US11189409B2 Electronic substrates having embedded dielectric magnetic material to form inductors Electricity 1 Active
US12057252B2 Electronic substrates having embedded inductors Electricity 0 Active
US12154715B2 Methods to selectively embed magnetic materials in substrate and corresponding structures Electricity 0 Active
US11244912B2 Semiconductor package having a coaxial first layer interconnect Electricity 0 Active
US11443892B2 Substrate assembly with encapsulated magnetic feature Electricity 0 Active
US11335632B2 Magnetic inductor structures for package devices Electricity 0 Active
US11651902B2 Patterning of thin film capacitors in organic substrate packages Electricity 0 Active
US10692965B2 3D conductive ink printing method and inductor formed thereof Electricity 0 Active
US11862552B2 Methods of embedding magnetic structures in substrates Electricity 0 Active
US12327797B2 Microelectronic structures including glass cores Electricity 0 Active
US10971492B2 Package-embedded thin-film capacitors, package-integral magnetic inductors, and methods of assembling same Electricity 0 Active
US11417614B2 Methods to embed magnetic material as first layer on coreless substrates and corresponding structures Electricity 0 Active
US11355459B2 Embedding magnetic material, in a cored or coreless semiconductor package Electricity 0 Active
US11901115B2 Substrate assembly with encapsulated magnetic feature Electricity 0 Active
US11450471B2 Methods to selectively embed magnetic materials in substrate and corresponding structures Electricity 0 Active
US10672859B2 Embedded magnetic inductor Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.