Method and system for providing a reverse-engineering resistant hardware embedded security module
US10381315B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 21, 2018 |
| Grant date | Aug 13, 2019 |
| Priority date | — |
| Expiry date | Mar 21, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/53257
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A hardware-embedded security system is described. The system includes connective components, circuit elements and an insulator. The connective components include a variable conductivity layer that is conductive for a first stoichiometry and insulating for a second stoichiometry. The variable conductivity layer is conductive for a first portion of the connective components connected to a first portion of the circuit elements. The variable conductivity layer is insulating for a second portion of the connective components connected to a second portion of the circuit elements. Thus, the first portion of the circuit elements are active and the second portion of the circuit elements are inactive. The insulator is adjacent to at least a portion of each of the connective components. The first stoichiometry may be indistinguishable from the second stoichiometry via optical imaging and electron imaging of a portion of the insulator and the variable conductivity layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.