Selective depositing of powder in additive manufacturing

US10384265B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Bharath Swaminathan · San Jose, US
• Ajey M. Joshi · San Jose, US
• Nag B. Patibandla · Pleasanton, US
• Hou T. Ng · Campbell, US
• Ashavani Kumar · Sunnyvale, US
• Eric Ng · Mountain View, US
• Bernard Frey · Livermore, US
• Kasiraman Krishnan · Clifton Park, US

Key dates

• Filing date: Jun 17, 2016
• Grant date: Aug 20, 2019
• Expiry date: Oct 17, 2037

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y02P10/25
• WIPO field: Materials, metallurgy
• WIPO sector: Chemistry

Abstract

A method of additive manufacturing include delivering at least one layer by either depositing a uniform layer of powder on a support and then removing a portion of the layer with a roller with a surface having spatially controlled electrostatic charge, or by depositing powder onto the surface of the roller and moving the roller relative to a support such that the spatially controllable electrostatic charge on the surface of the roller causes transfer of a corresponding portion of the powder from the roller onto the support or an underlying layer.