Patent · US Active

MEMS device and method of manufacturing a MEMS device

US10384934B2 · kind B2 · utility

0Cited by

3References

17Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Alfons Dehe · Reutlingen, DE
Stephan Pindl · Ergoldsbach, DE
Bernhard Knott · Dresden, DE
Carsten Ahrens · Birkenfeld, DE

Key dates

Filing date	Mar 16, 2018
Grant date	Aug 20, 2019
Priority date	—
Expiry date	Mar 16, 2038

Classification

Technology area (CPC H)Electricity
CPC primaryH04R2201/003
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A method for manufacturing a MEMS device is disclosed. Moreover a MEMS device and a module including a MEMS device are disclosed. An embodiment includes a method for manufacturing MEMS devices includes forming a MEMS stack over a first main surface of a substrate, forming a polymer layer over a second main surface of the substrate and forming a first opening in the polymer layer and the substrate such that the first opening abuts the MEMS stack.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.