Reinforcement panel for fingerprint sensor cover
US10387707B2 · kind B2 · utility
0Cited by
4References
21Claims
0Family size
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Key dates
| Filing date | Jun 20, 2017 |
| Grant date | Aug 20, 2019 |
| Priority date | — |
| Expiry date | Jul 22, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06V40/1365
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A fingerprint sensor assembly includes a capacitive fingerprint sensor disposed beneath a thin layer of glass and a reinforcement layer of a material of relatively high dielectric constant bonded to the glass between the glass layer and the sensor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.