Cleaning apparatus, chemical mechanical polishing system including the same, cleaning method after chemical mechanical polishing, and method of manufacturing semiconductor device including the same
US10388537B2 · kind B2 · utility
2Cited by
7References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 9, 2017 |
| Grant date | Aug 20, 2019 |
| Priority date | — |
| Expiry date | Feb 9, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67219
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A cleaning apparatus for removing particles from a substrate is provided. The cleaning apparatus includes a first cleaning unit including a first dual nozzle supplying, to a substrate, a first chemical liquid and a first spray including a first liquid dissolving the first chemical liquid, and a second cleaning unit including a second dual nozzle supplying, to the substrate, a second chemical liquid different from the first chemical liquid and a second spray including a second liquid dissolving the second chemical liquid and being the same as the first liquid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.