Semiconductor package device and method of manufacturing the same
US10388586B2 · kind B2 · utility
0Cited by
2References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 18, 2017 |
| Grant date | Aug 20, 2019 |
| Priority date | — |
| Expiry date | Aug 18, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30111
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package device comprises a substrate, a die, an encapsulant and an antenna layer. The substrate has a top surface and a bottom surface opposite to the top surface. The die is disposed on the top surface of the substrate. The encapsulant is disposed on the top surface of the substrate and surrounds the die. The encapsulant has a top surface and defines a recess on the top surface of the encapsulant. The antenna layer is disposed on the top surface of the encapsulant and extends within the recess on the top surface of the encapsulant.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.