Patent · US Active

Semiconductor chip and method for producing a semiconductor chip

US10388823B2 · kind B2 · utility

0Cited by
7References
11Claims
0Family size

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Key dates

Filing dateMay 12, 2017
Grant dateAug 20, 2019
Priority date
Expiry dateMay 12, 2037

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10H20/825
  • WIPO fieldOptics
  • WIPO sectorInstruments

Abstract

A semiconductor chip (100) is provided, having a first semiconductor layer (1), which has a lateral variation of a material composition along at least one direction of extent. Additionally provided is a method for producing a semiconductor chip (100).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.