Patent · US Active

Backside polisher with dry frontside design and method using the same

US10391608B2 · kind B2 · utility

1Cited by

4References

20Claims

0Family size

Assignee

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. · TW

Inventors

Chih-Hung Chen
Chia-Jung Hsu · Hsinchu, TW
Yi-An Lin · Taichung, TW

Key dates

Filing date	Dec 27, 2017
Grant date	Aug 27, 2019
Priority date	—
Expiry date	Dec 27, 2037

Classification

Technology area (CPC H)Electricity
CPC primaryH01L21/683
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A wafer polishing apparatus is described herein. The wafer polishing apparatus includes a polish module configured to apply air pressure to a first surface of a wafer while performing a polishing process on a second surface of the wafer. In some implementations, the polish module is further configured to perform a cleaning process and/or a drying process on the second surface of the wafer, such that the same wafer polishing apparatus is configured to perform the polishing process, the cleaning process, and/or the drying process. In some implementations, the polishing module is further configured to air seal edges of the wafer during the polishing process, the cleaning process, and/or the drying process.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.