Patent · US Active

Smart card module arrangement, smart card, method for producing a smart card module arrangement and method for producing a smart card

US10395157B2 · kind B2 · utility

0Cited by

2References

20Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Frank Pueschner · Kelheim, DE
Thomas Spoettl · Mintraching, DE
Jens Pohl · San Luis Obispo, US
Peter Stampka · Burglengenfeld, DE

Key dates

Filing date	Sep 11, 2014
Grant date	Aug 27, 2019
Priority date	—
Expiry date	Mar 20, 2035

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/18161
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method for producing a smart card module arrangement includes: arranging a smart card module on a first carrier layer, wherein the first carrier layer is free of a prefabricated smart card module receptacle cutout for receiving the smart card module. The smart card module includes: a substrate; a chip on the substrate; a first mechanical reinforcement structure between the chip and the substrate. The first mechanical reinforcement structure covers at least one part of a surface of the chip. The method further includes applying a second carrier layer to the smart card module, wherein the second carrier layer is free of a prefabricated smart card module receptacle cutout for receiving the smart card module; and at least one of laminating or pressing the first carrier layer with the second carrier layer, such that the smart card module is enclosed by the first carrier layer and the second carrier layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.