Substrate treating apparatus, substrate treating method, and plasma generating unit
US10395898B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 22, 2017 |
| Grant date | Aug 27, 2019 |
| Priority date | — |
| Expiry date | Aug 22, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67069
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Disclosed are a substrate treating apparatus, a substrate treating method, and a plasma generating unit. The substrate treating apparatus includes a housing configured to provide a treatment space, in which a substrate is treated, a support unit configured to support a substrate in the treatment space, a plasma generating unit disposed outside the housing and configured to excite plasma from a gas and supply the excited plasma to the treatment space, and a controller, wherein the plasma generating unit includes a plasma generating chamber having a space, into which a gas is introduced, a first antenna wound to surround the plasma generating chamber and connected to a power source through an electric wire, a second antenna wound around the plasma generating chamber and connected to the power source through an auxiliary electric wire, and a switch configured to switch on and off the auxiliary electric wire.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.