Patent · US Active

Flexible packaging architecture

US10396038B2 · kind B2 · utility

2Cited by

50References

11Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Bok Eng Cheah · Air Itam, MY
Jackson Chung Peng Kong · Merang, MY
Shanggar Periaman · Butterworth, MY
Michael P. Skinner · San Jose, US
Yen Hsiang Chew · Bukit Mertajam, MY
Kheng Tat MAR · Air Itam, MY
Ridza Effendi Abd Razak · Lunas, MY
Kooi Chi Ooi · Air Itam, MY

Key dates

Filing date	Sep 26, 2014
Grant date	Aug 27, 2019
Priority date	—
Expiry date	Sep 26, 2034

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/15311
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A flexible packaging architecture is described that is suitable for curved package shapes. In one example a package has a first die, a first mold compound layer over the first die, a wiring layer over the first mold compound layer, a second die over the wiring layer and electrically coupled to the wiring layer, and a second mold compound layer over the second die.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.