Inventor · San Jose, CA, US

Michael P. Skinner

14Patents
5h-index
31Co-inventors
62Inventor score

Filing activity: Jul 31, 1998 → May 4, 2016

Most-cited inventions

PatentTitleAreaCited byStatus
US6165892A Method of planarizing thin film layers deposited over a common circuit base Electricity 29 Expired
US6323435A Low-impedance high-density deposited-on-laminate structures having reduced stress Electricity 21 Expired
US6548224B1 Wiring substrate features having controlled sidewall profiles Electricity 19 Expired
US6934455B2 Waveguides with optical monitoring Physics 14 Expired
US9778688B2 Flexible system-in-package solutions for wearable devices Electricity 5 Active
US9142475B2 Magnetic contacts Electricity 4 Active
US9209143B2 Die edge side connection Electricity 3 Active
US10396038B2 Flexible packaging architecture Electricity 2 Active
US9343389B2 Magnetic contacts Electricity 1 Active
US9818672B2 Flow diversion devices Electricity 1 Active
US9646953B2 Integrated circuit packaging techniques and configurations for small form-factor or wearable devices Electricity 1 Active
US9601468B2 Magnetic contacts Electricity 0 Active
US7305019B2 Excimer laser with electron emitters Electricity 0 Expired
US9515049B2 Flexibly-wrapped integrated circuit die Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.