Optical module, manufacturing method thereof and electronic apparatus
US10396783B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 20, 2015 |
| Grant date | Aug 27, 2019 |
| Priority date | — |
| Expiry date | Nov 20, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K30/88
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An optical module includes a substrate, a lid, a light-emitting component, a first sensor and a second sensor. The lid is disposed on a surface of the substrate. The lid defines a first opening, a second opening and a third opening. The second opening is between the first opening and the third opening. The light-emitting component is disposed on the surface of the substrate and in the first opening. The first sensor is disposed on the surface of the substrate and in the second opening. The second sensor is disposed on the surface of the substrate and in the third opening.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.