Methods for acquiring planar view stem images of device structures
US10401265B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 19, 2018 |
| Grant date | Sep 3, 2019 |
| Priority date | — |
| Expiry date | Sep 19, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/31749
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method of preparing a sample that includes milling an initial deep lamella within a wafer using a focused ion beam. The initial deep lamella includes at least one internal structure within an upper portion of the initial deep lamella. The method further includes lifting the initial deep lamella out of the wafer, placing the initial deep lamella on an upper surface of the wafer on a lateral side of the initial lamella, milling a planar shallow lamella out of a portion of the initial deep lamella and the wafer beneath the initial deep lamella to include at least substantially an entire length of the at least one internal structure of the initial deep lamella, lifting the planar shallow lamella out of the wafer, and placing the planar shallow lamella on a carbon grid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.