Post-packaging repair of redundant rows
US10403390B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 9, 2018 |
| Grant date | Sep 3, 2019 |
| Priority date | — |
| Expiry date | Apr 18, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11C2029/0409
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Systems and methods to perform post-packaging repair of previously repaired data groups are disclosed. The devices may have an array of addressable rows or columns of memory cells, which can be activated. Upon identification of defect in a memory cell row or column, a repair in which the memory cell may be deactivated and a secondary row may be activated in its place may be performed. Volatile and non-volatile storage elements may be used to store the defective memory addresses. Logic circuitry in the device may match a requested address with the stored addresses and generate logic signals that trigger activation of a repaired row in place of the defective row or column. Moreover, defective rows or columns that have been previously repaired once may be further repaired. To that end, logic circuitry implementing a trumping mechanism may be used to prevent activation of multiple data rows or columns for addresses that were repaired multiple times.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.