Substrate processing apparatus
US10403517B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 16, 2016 |
| Grant date | Sep 3, 2019 |
| Priority date | — |
| Expiry date | Jul 2, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67248
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A supply flow passage branches into a plurality of upstream flow passages. A plurality of discharge ports are respectively disposed at a plurality of positions differing in distance from a rotational axis of a substrate. Hydrogen peroxide water, that is one of components of a chemical liquid (SPM), is supplied to the upstream flow passage from a component liquid flow passage. A mixing ratio changing unit including a plurality of first flow control valves and a plurality of second flow control valves independently changes mixing ratios of sulfuric acid and hydrogen peroxide water included in the chemical liquid to be discharged from the plurality of discharge ports for each of the upstream flow passages.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.