Substrate-processing apparatus and method of manufacturing semiconductor device
US10403528B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 22, 2017 |
| Grant date | Sep 3, 2019 |
| Priority date | — |
| Expiry date | Oct 27, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68707
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate processing apparatus includes a process chamber and a transfer device configured to transfer a plurality of substrates to a substrate retainer. The transfer device includes a base; a first moving unit capable of linear motion; a first drive unit to drive the first moving unit. The first drive unit includes a first pulley group; a first motor coupled to a first pulley; and a first connecting member coupling the first belt and the first moving unit. A second moving unit is capable of linear motion. A second drive unit is in an enclosure of the first moving unit and drives the second moving unit. The second drive unit includes a second pulley group; a second belt wound on the second pulley group, a second motor coupled to drive a second pulley; and a second connecting member coupling the second belt and the second moving unit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.