Patent · US Active

Power module

US10403566B2 · kind B2 · utility

0Cited by

4References

11Claims

0Family size

Assignee

DANFOSS SILICON POWER GMBH · DE

Inventors

Ronald Eisele · Surendorf, DE
Frank Osterwald · Kiel, DE

Key dates

Filing date	Jan 29, 2016
Grant date	Sep 3, 2019
Priority date	—
Expiry date	Jan 29, 2036

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2224/8384
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A power module (10) having a leadframe (20), a power semiconductor (30) arranged on the leadframe (20), a base plate (40) for dispersing heat generated by the power semiconductor (30) and a potting compound (50) surrounding the leadframe (20) and the power semiconductor (30), that physically connects the power semiconductor (30) and/or the leadframe (20) to the base plate (40).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.