Light emitting diode assembly using thermal pyrolytic graphite for thermal management
US10403806B2 · kind B2 · utility
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16Claims
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Key dates
| Filing date | May 13, 2016 |
| Grant date | Sep 3, 2019 |
| Priority date | — |
| Expiry date | May 13, 2036 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF21Y2115/10
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A light emitting diode assembly comprising such thermal management assembly is shown and described herein. The light emitting diode assembly may comprise a light emitting diode in thermal contact with a heat spreader. The heat spreader may comprise a core and/or fins. The core and/or fins comprise a thermal pyrolytic graphite material. The thermal management assembly comprising the core and/or fins can dissipate heat from the light emitting diode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.