Parallel seam welding leadless ceramic package
US10410960B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 28, 2017 |
| Grant date | Sep 10, 2019 |
| Priority date | — |
| Expiry date | Aug 28, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2223/6683
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The application discloses a parallel seam welding leadless ceramic package, including a ceramic, a sealing ring and a metal cover plate; a back surface of the ceramic is provided with a back grounding metal pattern, and the back grounding metal pattern is provided with several outwardly protruding grounding terminals, a RF signal transmission pad is disposed between every two adjacent grounding terminals, the front grounding metal pattern and the back grounding metal pattern are interconnected by the internal and/or external metallized interconnection holes, the front grounding line and the back grounding metal pattern is interconnected by the internal or external metallized interconnection holes, and the RF signal transmission lines are interconnected to the RF signal transmission pad by a separated external and/or external metallized interconnection hole.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.