Electronic package and method for fabricating the same
US10410970B1 · kind B1 · utility
7Cited by
6References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 30, 2018 |
| Grant date | Sep 10, 2019 |
| Priority date | — |
| Expiry date | May 30, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic package is provided. An electronic component and a plurality of conductive pillars are provided on a carrier structure. An encapsulation layer encapsulates the electronic component and the conductive pillars. Each of the conductive pillars has a peripheral surface narrower than two end surfaces of the conductive pillar. Therefore, the encapsulation layer is better bonded to the conductive pillars. A method for fabricating the electronic package is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.