Polishing composition containing ceria particles and method of use
US10414947B2 · kind B2 · utility
0Cited by
16References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 29, 2016 |
| Grant date | Sep 17, 2019 |
| Priority date | — |
| Expiry date | Dec 9, 2036 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC01P2006/12
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The invention provides a chemical-mechanical polishing composition including wet-process ceria particles having a median particle size of about 25 nm to about 150 nm and a particle size distribution of about 300 nm or more, and an aqueous carrier. The invention also provides a method of polishing a substrate, especially a substrate comprising a silicon layer, with the polishing composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.