Environmentally robust plating configuration for metal-diamond composites substrate
US10418257B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 24, 2018 |
| Grant date | Sep 17, 2019 |
| Priority date | — |
| Expiry date | Jul 24, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/42
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure relates to a substrate with a plating configuration and a process for making the same. The disclosed substrate includes a substrate base with a substrate body, and a plating configuration with a plating seed layer and a plating barrier layer. Herein, the substrate body is formed of metal-diamond composites. The plating seed layer is formed of copper, silver, or gold, and the plating barrier layer includes nickel material. The plating seed layer directly covers at least sidewalls of the substrate body, and the plating barrier layer is directly formed over the plating seed layer and encloses the substrate base.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.