Substrate processing method
US10418589B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 31, 2017 |
| Grant date | Sep 17, 2019 |
| Priority date | — |
| Expiry date | Sep 16, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K71/166
Abstract
A substrate processing system and substrate processing method. The substrate processing system includes: a chamber; a susceptor disposed inside the chamber and allowing a substrate to be seated thereon; a mask member disposed over the substrate; and a controller for controlling an arrangement height of the mask member with respect to the substrate. Here, an encapsulation layer covering a device formed on the substrate is formed using the mask member adjusted in height by the controller. The substrate processing method includes disposing a substrate inside a chamber; disposing a mask member over the substrate inside the chamber; and forming an encapsulation layer covering a device formed on the substrate by adjusting an arrangement height of the mask member with respect to the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.