Patent · US Active

Abrasive particle-dispersion layer composite and polishing slurry composition including the same

US10421883B2 · kind B2 · utility

0Cited by
2References
14Claims
0Family size

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Key dates

Filing dateDec 21, 2016
Grant dateSep 24, 2019
Priority date
Expiry dateDec 21, 2036

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L21/3212
  • WIPO fieldBasic materials chemistry
  • WIPO sectorChemistry

Abstract

An abrasive particle-dispersion layer composite and a polishing slurry composition including the abrasive particle-dispersion layer composite are provided. The abrasive particle-dispersion layer composite includes abrasive particles, a first dispersant that is at least one cationic compound among an amino acid, an organic acid, polyalkylene glycol and a high-molecular polysaccharide coupled to a glucosamine compound, and a second dispersant that is a cationic polymer including at least two ionized cations in a molecular formula.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.