Thermal management of molded packages

US10424559B2 · kind B2 · utility

Assignee

• Intel Corporation · US

Inventors

• Feras Eid · Chandler, US
• Nader N. Abazarnia · Chandler, US
• Johanna M. Swan · Scottsdale, US
• Taesha D. Beasley · Chandler, US
• Sasha N. Oster · Chandler, US
• Tannaz Harirchian · Chandler, US
• Shawna M. Liff · Scottsdale, US

Key dates

• Filing date: Dec 22, 2016
• Grant date: Sep 24, 2019
• Expiry date: Dec 22, 2036

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/15311
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An embodiment includes an apparatus comprising: a semiconductor die; package molding that is molded onto and conformal with a first die surface of the semiconductor die and at least two sidewalls of the semiconductor die, the package molding including: (a)(i) a first surface contacting the semiconductor die, (a)(ii) a second surface opposite the first surface, and (a)(iii) an aperture that extends from the first surface to the second surface; and a polymer substantially filling the aperture; wherein the package molding includes a first thermal conductivity (watts per meter kelvin (W/(m·K)) and the polymer includes a second thermal conductivity that is greater than the first thermal conductivity. Other embodiments are described herein.