Semiconductor package device and method of manufacturing the same
US10424566B2 · kind B2 · utility
0Cited by
2References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 30, 2016 |
| Grant date | Sep 24, 2019 |
| Priority date | — |
| Expiry date | Jan 30, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48091
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An electronic device comprises a carrier, an emitter, a detector, a separation wall and a light shielding layer. The emitter is disposed on a first portion of the top surface of the carrier. The detector is disposed on a second portion of the top surface of the carrier. The separation wall is disposed on the top surface of the carrier between the emitter and the detector. The light shielding layer disposed adjacent to the top surface of the carrier and extends from the separation wall to the second portion of the carrier.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.