Die-to-die interface configuration and methods of use thereof

US10424921B2 · kind B2 · utility

Assignee

• QUALCOMM Incorporated · US

Inventors

• Kenneth Dubowski · San Diego, US
• LuVerne Ray Peterson · San Diego, US
• Thomas Clark Bryan · Carlsbad, US
• Stephen Knol · San Diego, US
• Sreeker Dundigal · San Diego, US
• Alvin Leng Sun Loke · Fort Collins, US

Key dates

• Filing date: Feb 16, 2017
• Grant date: Sep 24, 2019
• Expiry date: Dec 2, 2037

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2224/08135
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A semiconductor die including: a die-to-die interface including an input/output (I/O) circuitry area and an electrical contact area; wherein the electrical contact area includes an array of electrical contacts disposed on a side of the semiconductor die; and wherein the I/O circuitry area includes a plurality of drivers, each of the drivers coupled to at least one electrical contact in the electrical contact area, and a plurality of electrostatic discharge (ESD) protection devices, each of the ESD protection devices coupled to a respective driver, further wherein the I/O circuitry area and the electrical contact area are separated in a top-down view of the semiconductor die.