Substrate deposition systems, robot transfer apparatus, and methods for electronic device manufacturing

US10427303B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• William T. Weaver · Austin, US
• Malcolm N. Daniel, JR. · Austin, US
• Robert Brent Vopat · Austin, US
• Jason M. Schaller · Austin, US
• Jacob Newman · Palo Alto, US
• Dinesh Kanawade · Melville, US
• Andrew J. Constant · Cupertino, US
• Stephen C. Hickerson · Hollister, US
• Jeffrey C. Hudgens · San Francisco, US
• Marvin L. Freeman · Boynton, US

Key dates

• Filing date: Mar 14, 2014
• Grant date: Oct 1, 2019
• Expiry date: Jun 12, 2035

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T74/20305
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Electronic device processing systems may include a mainframe housing having a transfer chamber, a first carousel assembly, a second carousel assembly, a first load lock, a second load lock, and a robot adapted to operate in the transfer chamber to exchange substrates between the first and second carousels and the first and second load locks. The robot may include first and second end effectors operable to extend and/or retract simultaneously or sequentially along substantially co-parallel lines of action. Methods and multi-axis robots for transporting substrates are described, as are numerous other aspects.