Slurry composition for chemical mechanical polishing
US10428242B2 · kind B2 · utility
0Cited by
7References
20Claims
0Family size
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Key dates
| Filing date | Feb 15, 2018 |
| Grant date | Oct 1, 2019 |
| Priority date | — |
| Expiry date | Feb 15, 2038 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09K3/1463
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A slurry composition for chemical mechanical polishing, the slurry composition including ceramic polishing particles; a dispersion agent; a pH control agent and an additive having affinity with silicon nitride.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.