KC TECHNOLOGY CO., LTD.
23Patents
16Active
23Granted
46Portfolio score
Filing activity: Mar 3, 1999 → Mar 17, 2022 · 7 expiring within 5 years
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7442112B2 | Nozzle for spraying sublimable solid particles entrained in gas for cleaning surface | Performing Operations; Transporting | 52 | Active |
| US6347380B1 | System for adjusting clock rate to avoid audio data overflow and underrun | Physics | 21 | Expired |
| US7762869B2 | Nozzle for spraying sublimable solid particles entrained in gas for cleaning surface | Performing Operations; Transporting | 11 | Active |
| US8968476B2 | Atomic layer deposition apparatus | Electricity | 6 | Active |
| US8939817B2 | Membrane assembly and carrier head having the membrane assembly | Performing Operations; Transporting | 6 | Active |
| US8662956B2 | Conditioner of chemical mechanical polishing apparatus | Performing Operations; Transporting | 6 | Active |
| US7013660B2 | System for forming aerosols and cooling device incorporated therein | Mechanical Engineering; Lighting; Heating | 5 | Expired |
| US7270136B2 | Apparatus for cleaning the edges of wafers | Emerging Cross-Sectional Technologies | 5 | Expired |
| US7470295B2 | Polishing slurry, method of producing same, and method of polishing substrate | Electricity | 4 | Expired |
| US8062547B2 | CMP slurry, preparation method thereof and method of polishing substrate using the same | Electricity | 3 | Active |
| US7892069B2 | Loading device of chemical mechanical polishing equipment for semiconductor wafers | Performing Operations; Transporting | 3 | Active |
| US7364600B2 | Slurry for CMP and method of polishing substrate using same | Electricity | 2 | Expired |
| US9704729B2 | Substrate cleaning apparatus and method and brush assembly used therein | Performing Operations; Transporting | 2 | Active |
| US8882563B2 | Chemical mechanical polishing system | Performing Operations; Transporting | 2 | Active |
| US7674156B2 | Cleaning device for chemical mechanical polishing equipment | Performing Operations; Transporting | 1 | Active |
| US6978625B1 | System for forming aerosols and cooling device incorporated therein | Mechanical Engineering; Lighting; Heating | 1 | Expired |
| US7008306B2 | Nozzle for injecting sublimable solid particles entrained in gas for cleaning a surface | Emerging Cross-Sectional Technologies | 0 | Expired |
| US10435587B2 | Polishing compositions and methods of manufacturing semiconductor devices using the same | Electricity | 0 | Active |
| US9991127B2 | Method of fabricating integrated circuit device by using slurry composition | Electricity | 0 | Active |
| US8491682B2 | Abrasive particles, method of manufacturing the abrasive particles, and method of manufacturing chemical mechanical polishing slurry | Chemistry; Metallurgy | 0 | Active |
| US10428242B2 | Slurry composition for chemical mechanical polishing | Chemistry; Metallurgy | 0 | Active |
| USD1034261S1 | Image magnifying and polarizing lens assembly for measuring device | General | 0 | Active |
| US8361177B2 | Polishing slurry, method of producing same, and method of polishing substrate | Chemistry; Metallurgy | 0 | Active |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.