Fabrication method for two-dimensional materials
US10428427B2 · kind B2 · utility
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7References
16Claims
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Key dates
| Filing date | Sep 8, 2017 |
| Grant date | Oct 1, 2019 |
| Priority date | — |
| Expiry date | Sep 8, 2037 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C28/04
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A fabrication method for two-dimensional materials of the present invention includes the following steps: forming a thin film having at least one two-dimensional element on a substrate; forming at least one capping layer on the thin film; annealing the thin film to form a two-dimensional material film after the capping layer is formed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.