Indium electroplating compositions containing amine compounds and methods of electroplating indium
US10428436B2 · kind B2 · utility
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Key dates
| Filing date | May 12, 2017 |
| Grant date | Oct 1, 2019 |
| Priority date | — |
| Expiry date | Sep 9, 2037 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D7/123
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Indium electroplating compositions containing amine compounds in trace amounts to electroplate substantially defect-free uniform indium which has a smooth surface morphology. The indium electroplating compositions can be used to electroplate indium metal on metal layers of various substrates such as semiconductor wafers and as thermal interface materials.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.